跳至主要內容
新群科技
About Nutrim
Service
Temporary Bonding / Debonding Services
Filming on high warpage Wafer/Glass
Laser Mark Test
Products
EFEM
Wafer Inspection
Temporary Bonding and Debonding
Laser marker
Packaging Solutions
Processing Theories
半導體產業相關用語(中英)
Contact Us
選單
About Nutrim
Service
Temporary Bonding / Debonding Services
Filming on high warpage Wafer/Glass
Laser Mark Test
Products
EFEM
Wafer Inspection
Temporary Bonding and Debonding
Laser marker
Packaging Solutions
Processing Theories
半導體產業相關用語(中英)
Contact Us
Temporary Bonding | Debonding Services
預約進行打樣測試
從我們生產的第一台全自動Temporary bonder設備至今已累積超過10年以上、數十家以上客戶導入經驗。我們可以提供晶圓尺寸從4吋到12吋的打樣服務。所提供的打樣服務皆在我們廠內一條龍完成。
Spin Coat
Bake
Bond
Mechanical or Thermal Debond
Cleaning
進一步了解自動生產設備
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